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High Density Interconnection

It is a PCB with precise electrical components that is made to meet the needs for slimness, high density integration and high reliability.

It is mostly used in server, desktop, PC, laptop, and tablet PC.

Semiconductor Package Substrate

It is a core part in semiconductor packaging process, which is a high density board of fine circuit that connects semiconductor's electrical signal to the mainboard.

It is used for automotive and various mobile devices that require high reliability.