SIMMTECH R&D Center plays the important role to lead future technology.
After establishing the company in 1987, started to develop SIMM PCB of its own, which have regarded as impossible to produce domestically in early 1990 and succeded to localize and prospered and grew repeatedly and was chosen "sole partner" for developing PCB for the advanced DRAM of Rambus Corp. in America, which is the world-best semiconductor design company in 2000. In 2001, co-developed advanced build up flip chip BGA with Japanese CMK Corp,. In 2003, developed BOC(Board on Chip) is the essential components for memory package. Now it is registered as the World First Class Product and also became the World First-Rank Company simultaneously.
Since establishing annex SIMMTECH R&D in 1993, set up SIMMTECH R&D Center in Ochang Science industrial park in 2006, strived to develop advanced product's preceding technology and next generation new product, whose core technology as Memory module substrate and IC Package substrate and keep discovering future cash-cow by developing competitive high-quality product and core-technology aiming "Integrity" as fundamental motto and "Technology Only" as Technology Spirit.
SIMMTECH R&D Center is focusing on developing product and technology that customer need and are involved, will further develop state of the art product in memory and non-memory fields and provide its solutions by developing next-generation convergence technology.