HDI(High Density Interconnection)
It is a PCB with precise electrical components that is made to meet the needs for slimness, high density integration and high reliability.
It is mostly used in server, desktop, PC, laptop, and tablet PC.
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Overview
The First Data Center-Grade Modular Form Factor for AI Servers
Combining LPDDR5X and CAMM, this compact module delivers high efficiency, bandwidth, and thermal performance for AI data centers
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Core Technology
- Fine Pattern
- Multi Layer (MLB, Build up)
- Low Dk, Low Df, Low CTE
- Impedance Control
- Selective ENIG
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Specifications
Layer 16 Layers (4-8-4) Thickness 1,600㎛ Line/Space (Tenting) 75㎛ / 100㎛ Via Size (Laser Via) 100㎛ Surface Finish OSP / Selective ENIG OSP : Organic Solderability Preservative, ENIG : Electroless Nickel Immersion Gold -
Product Image
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Application
- AI Data Center Servers