HDI(High Density Interconnection)
It is a PCB with precise electrical components that is made to meet the needs for slimness, high density integration and high reliability.
It is mostly used in server, desktop, PC, laptop, and tablet PC.
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Overview
Next-generation DRAM Memory Module PCB with LPDDR for low-power, high-performance and area minimization
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Core Technology
- Multi Layer (MLB, Build Up)
- Low Dk, Low Df, Low CTE
- Impedance Control
- Selective ENIG
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Specifications
Layer 10 ~ 12 Layers Thickness 1,000㎛ Line/Space (Tenting) 50 / 100㎛ Via Size 200㎛ Surface Finish OSP / Selective ENIG OSP : Organic Solderability Preservative, ENIG : Electroless Nickel Immersion Gold -
Product Image
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Application
- Laptop