SPS(Semiconductor Package Substrate)
It is a core part in semiconductor packaging process, which is a high density board of fine circuit that connects semiconductor's electrical signal to the mainboard.
It is used for automotive and various mobile devices that require high reliability.
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Overview
- FCCSP (Flip Chip Chip Scale Package)
- FCCSP connects the chip with bumping insteadd of wirebonding.
- Among FCCSP products designed for memory, a typical oprtion is the GDDR Substrate intended for graphic processing.
- This product is fabricated with 4~6 layers of substrate and connected via Flipchip bump. GDDR Packaging is positioned around the GPU to swiftly transmit the memory needed for implementing and processing graphics.
- Application
- Graphic Card/Game Console/Automotive Graphic DRAM
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Core Technology
- Pattern Process : MSAP
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Specifications
GDDR6 GDDR7 Layer & Thickness 4L 246~308µm 208~268µm 6L 260µm 262µm Trace Pitch (Width/Space) 55pt (25/30) ← Bump Pitch 57pt (25/32) ← SR SR1, SR1-Z, AUS308 MG1-Z, AUS308 OSP OSP(Shikoku) ← -
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